Integrated circuit (IC) substrates are found in many modern devices around the world – from 5G base stations for mobile communications to high-performance computers. Modern microchips combine billions of transistors into a very small space. IC substrates are used to connect these highly complex microchips to circuit boards that carry memory, power, and other critical computer components.
IC substrates connect the tiny inputs and outputs of powerful microchips to the larger structures on the circuit board, creating a bridge between the nano world of the semiconductor industry and the micro world of circuit boards.
Today, IC substrates house nearly all high-performance microchips and are critical to any form of data processing. As semiconductor manufacturers seek to create more powerful and energy-efficient microchips, transistors must become smaller and smaller.
As transistors approach the atomic scale, IC substrates are becoming increasingly popular in microchip development. Styrian Group AT&S uses an assembly method with highly automated and non-contact processes in a clean room environment to manufacture its substrates.
A reinforced core, the so-called core, is produced through copper-plated holes. This core serves as the basis for creating the dielectric and insulating multilayers for the copper circuit.
The so-called flip-chip technology is a combination technology and packaging of high-performance semiconductors. This process involves making thousands of contacts between the microchip's terminals and the substrate via tiny solder balls. The work is carried out in my range i.e. micrometer range. A micrometer is equal to 0.001 millimeter. This type of connectivity enables communication densities unachievable with older technologies.
